JPH0140220Y2 - - Google Patents
Info
- Publication number
- JPH0140220Y2 JPH0140220Y2 JP7796983U JP7796983U JPH0140220Y2 JP H0140220 Y2 JPH0140220 Y2 JP H0140220Y2 JP 7796983 U JP7796983 U JP 7796983U JP 7796983 U JP7796983 U JP 7796983U JP H0140220 Y2 JPH0140220 Y2 JP H0140220Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- molding agent
- circuit board
- partition wall
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 25
- 238000005192 partition Methods 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 description 22
- 238000004891 communication Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000012530 fluid Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7796983U JPS59182983U (ja) | 1983-05-24 | 1983-05-24 | 回路部品の密封構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7796983U JPS59182983U (ja) | 1983-05-24 | 1983-05-24 | 回路部品の密封構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59182983U JPS59182983U (ja) | 1984-12-06 |
| JPH0140220Y2 true JPH0140220Y2 (en]) | 1989-12-01 |
Family
ID=30207981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7796983U Granted JPS59182983U (ja) | 1983-05-24 | 1983-05-24 | 回路部品の密封構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59182983U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH079426Y2 (ja) * | 1988-07-01 | 1995-03-06 | 富士通テン株式会社 | 電子機器 |
-
1983
- 1983-05-24 JP JP7796983U patent/JPS59182983U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59182983U (ja) | 1984-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6583355B2 (en) | Bladder insert for encapsulant displacement | |
| JPH04321259A (ja) | 半導体装置 | |
| JPH0140220Y2 (en]) | ||
| US6340791B1 (en) | Means and process for encapsulating electric circuits by means of injection molding | |
| JPS6328052A (ja) | 電力用半導体モジュ−ル | |
| KR20010069988A (ko) | 몰드, 몰드 제조 방법, 집적 회로 캡슐화 방법 및, 이방법에 의해 캡슐화된 집적 회로 | |
| CN105318080B (zh) | 一种电子膨胀阀、电机线圈、电路板组件以及灌胶方法 | |
| US3439234A (en) | Self-venting housing for capacitors | |
| JPH11103178A (ja) | 乗物搭載用電子制御装置内基板保持構造 | |
| JPS6130747B2 (en]) | ||
| JPH04197716A (ja) | 基板の封止方法 | |
| JP2671168B2 (ja) | 筐体の封止方法 | |
| CN214545047U (zh) | 一种电路板保护盒 | |
| US3474185A (en) | Thin skin packaging for electrical components | |
| JPH0723952Y2 (ja) | 樹脂封止構造 | |
| CN217467925U (zh) | 一种背面灌胶的led数码管壳结构 | |
| JPH0546260Y2 (en]) | ||
| KR100608356B1 (ko) | 반도체 칩 패키지 몰딩 방법 | |
| JPH0546261Y2 (en]) | ||
| JPS6052672B2 (ja) | 高圧発生装置の製造方法 | |
| JPS5929442A (ja) | 半導体装置用リ−ドフレ−ム | |
| JPH0610664Y2 (ja) | 高圧コンデンサ | |
| JPH0610662Y2 (ja) | 高圧コンデンサ | |
| JP3310577B2 (ja) | ソリッドステートリレー及びその製造方法 | |
| JPS6074655A (ja) | 半導体装置 |